Laptops and Tablets

Created on 11.13

PMI foam, with characteristics such as lightweight and high strength, excellent dielectric properties, and low thermal conductivity, meets the core requirements of laptops and tablets for thinness, lightness, stability, and sound quality optimization. It is mainly applied to key parts such as shell structures, sound-generating components, internal protection, and heat dissipation. The specific brief introduction is as follows:

Shell and internal structural parts: It is often compounded with carbon fiber and other materials to form a sandwich structure of "panel + PMI foam", which is used in laptop shells, frames, or tablet midframes and other components. With a density of only 0.05 - 0.3g/cm³, it can significantly reduce the overall weight of the device. Meanwhile, its specific strength is 3 - 5 times that of traditional PVC foam, providing reliable mechanical support to resist damage from daily drops and collisions, while balancing the device's thin and light design with structural stability. In addition, its excellent insulation performance can avoid internal circuit short circuits or signal interference, ensuring stable equipment operation.

Speaker diaphragms: After processing, PMI foam can be made into ultra-thin film materials with a thickness of 0.08 - 0.85mm, suitable for built-in speaker diaphragms of laptops and tablets. This material has both good temperature resistance and flexibility, enabling high-quality low-frequency response for fuller device sound quality. At the same time, its lightweight characteristic can reduce the inertia of the diaphragm during vibration, improving sound reproduction, which meets the demand for miniaturized and high-quality sound-generating components in portable devices.

Heat dissipation auxiliary parts: PMI foam has a low thermal conductivity of about 0.03W/(m·K), and can be used as an internal thermal insulation or heat dissipation auxiliary material for devices. For example, setting a PMI foam thermal insulation layer between the laptop motherboard and shell, or around the tablet chip, can prevent local high temperature from spreading to the device surface or other precision components. This not only avoids scalding users during use but also reduces the impact of high temperature on component life, and its lightweight characteristic will not add extra burden to the device.