RUSSCOMP® SP
High-performance PMI foam for electronics: lightweight, excellent dielectric & thermal management. Used in electronic packaging, thermal management, 5G/communication devices.
The specific applications are as follows:
Electronic Component Packaging and Protection: PMI Foam has a low density, which can significantly reduce the packaging weight of electronic components. Meanwhile, its high specific strength provides reliable mechanical support, preventing components from being damaged by impact or vibration during transportation or use. With excellent insulation performance (dielectric constant of 1.05-1.2 and dielectric loss tangent ≤10⁻³), it can effectively isolate current in circuits, avoiding short circuits or signal interference. It is suitable for circuit board supports, insulation layers, and protective casings of electronic devices such as mobile phones, computers, and servers.
Heat Dissipation and Thermal Management: PMI Foam has a low thermal conductivity of approximately 0.03W/(m·K), making it an ideal heat dissipation material for electronic devices. It can effectively prevent heat accumulation inside the equipment, reduce the operating temperature of components, and extend their service life. For example, it is used as heat sinks or heat dissipation substrates in mobile phones and tablets, which can maintain the slim and lightweight design of the devices while improving heat dissipation efficiency. In 5G base stations, it can be used as thermal and acoustic insulation material to solve the heating problem in high-frequency signal transmission and ensure stable operation of the equipment.
5G and Communication Equipment: PMI Foam exhibits small changes in dielectric constant and loss within the frequency range of 2-26GHz, with excellent microwave transmission performance and extremely low radar wave penetration loss. Additionally, its infrared stealth characteristics can reduce the risk of equipment detection. It is suitable for 5G base station radomes, radar covers, and communication components of stealth aircraft, meeting the comprehensive requirements of "lightweight, high wave transmission, and low detectability".
Composite Material Sandwich Structures: As the core material of sandwich structures, PMI Foam can be compounded with reinforcing materials such as carbon fiber and glass fiber to form a "panel + foam + panel" sandwich structure. This structure has high specific strength and high specific stiffness, and is more than 30% lighter than traditional honeycomb structures. It can effectively reduce the weight of electronic equipment such as drone wings and satellite brackets while improving structural stability.
