XindeFoam® AP

It is mainly used in the aerospace field, such as the fairings and interstages of launch vehicles.

XindeFoam® SP

High-performance PMI foam for electronics: lightweight, excellent dielectric & thermal management. Used in electronic packaging, thermal management, 5G/communication devices.

XindeFoam® RTP

Russcomp® RTP has a wide application range, suitable for most sandwich-structured composite parts like X-Ray/CT tables, sports equipment, vehicles/high-speed railways, and floating/fishing kits.

XindeFoam® FRP

It has excellent flame-retardant properties, making it particularly suitable for applications in rail transit, shipbuilding, and the aviation industry.

XindeFoam® HTP

Withstands medium-temperature curing (max 200℃); mainly for high-grade composite components in aircraft, space/launch vehicles, UAVs, ships, etc.

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